Thư Viện trường Đại Học Nha Trang

Computer-Aided Design of Integrated Circuits and Systems, Tập 32, Số 4, 2013

Mục lục:

STT	Nội dung
1	Modeling and Application of Multi-Port TSV Networks in 3-D IC / Wei Yao and others
2	TSV-Aware Analytical Placement for 3-D IC Designs Based on a Novel Weighted-Average Wirelength Model / Meng-Kai Hsu, Valeriy Balabanov, and Yao-Wen Chang
3	An Analytical Placement Framework for 3-D ICs and Its Extension on Thermal Awareness / Guojie Luo, Yiyu Shi, Member, IEEE, and Jason Cong
4	Testing 3-D IC Through-Silicon-Vias (TSVs) by Direct Probing / Nabeeh Kandalaft, Rashid Rashidzadeh and Majid Ahmadi
5	Pre-Bond Probing of Through-Silicon Vias in 3-D Stacked ICs / Brandon Noia and Krishnendu Chakrabarty,
6	On Effective Through-Silicon Via Repair for 3-D-Stacked ICs / Li Jiang, Qiang Xu, and Bill Eklow
7	On Effective Through-Silicon Via Repair for 3-D-Stacked ICs / Li Jiang, Qiang Xu and Bill Eklow
8	A Built-In Self-Rpair Scheme for 3-D RAMs With Interdie Redundancy / Che-Wei Chou, Yu-Jen Huang, and Jin-Fu Li
9	3-D Mesh-Based Optical Network-on-Chip for Multiprocessor System-on-Chip / Yaoyao Ye and others
10	Exploration and Optimization of 3-D Integrated DRAM Subsystems / Christian Weis, Luca Benini and Norbert Wehn
11	Symbolic Matching and Constraint Generation for Systematic Comparison of Analog Circuits / Cristian Ferent and Alex Doboli
12	A Statistical Framework for Post-Fabrication Oxide reakdown Reliability Prediction and Management / Cheng Zhuo, Dennis Sylvester and David Blaauw
13	Test Clock Domain Optimization to Avoid Scan Shift Failure Due to Flip-Flop Simultaneous Triggering / Yu-Chiuan Huang and others