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Nhan đề
| Enhanced Boiling Heat Transfer by Using Micro-Pin-Finned Surface in Three Different Test Systems / Yanfang Xue and others |
|
Mô tả vật lý
| From p169-175 |
|
Từ khóa tự do
| heat flux |
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Từ khóa tự do
| integrated circuits |
|
Tác giả(bs) CN
| Aixiang, Ma |
|
Tác giả(bs) CN
| Jinjia, Wei |
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Tác giả(bs) CN
| Minzhe, Yuan |
|
Nguồn trích
| Heat transfer engineering : An International Journal-
Số: 11-12
Tập: 32
Năm: 2011 |
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| 039 | |y20171121142004|zvinhpq |
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| 245 | |aEnhanced Boiling Heat Transfer by Using Micro-Pin-Finned Surface in Three Different Test Systems / |cYanfang Xue and others |
|---|
| 300 | |aFrom p169-175 |
|---|
| 653 | |aheat flux |
|---|
| 653 | |aintegrated circuits |
|---|
| 700 | |aAixiang, Ma |
|---|
| 700 | |aJinjia, Wei |
|---|
| 700 | |aMinzhe, Yuan |
|---|
| 773 | |tHeat transfer engineering : An International Journal|d2011|v32|i11-12 |
|---|
| 890 | |c1 |
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